Pengaruh Temperatur Proses Curing Terhadap Sifat Thermal Komposit Epoksi Berpengisi Nanopartikel Sn-3.5Ag

Abstract

Electrically Conductive Adhesive (ECA) is an alternative solder substitute that does not contain Pb. In this research, we made nanocomposite from epoxy resin as matrix and Sn-3.5Ag nanoparticle as filler to determine the nanocomposite thermal properties for ECA applications. We used curing process temperature variations of 30, 65 and 95 ^oC with sonication for 30 minutes. Differential Scanning Calorimetry (DSC) analysis showed an increase of glass transition temperature (T_g) and degradation temperature (T_d), decreasing curing temperature (T_curing) as the curing process temperature increased while the melting temperature (T_m) and crystallization temperature (T_c) tend to be constant. T_g for curing process 30, 65 and 95 ^oC was 35.58; 37.41 and 43.77 ^oC respectively. T_d for curing process 30, 65 and 95 ^oC was 335.01; 337.50 and 342.49 ^oC. T_curing in the curing process 30 and 65 ^oC was 179.95 and 176.08 ^oC. Thermogravimetric Analysis (TGA) showed that nanocomposite T_d between 330-340 ^oC.