Pengaruh Temperatur Proses Curing Terhadap Sifat Thermal  Komposit Epoksi Berpengisi Nanopartikel Sn-3.5Ag

Tri Partuti; Yanyan Dwiyanti; Adhitya Trenggono; Fuji Utari

Tri Partuti Jurusan Teknik Metalurgi, Universitas Sultan Ageng Tirtayasa, Cilegon, Banten, Indonesia
Yanyan Dwiyanti Jurusan Teknik Metalurgi, Universitas Sultan Ageng Tirtayasa, Cilegon, Banten, Indonesia
Adhitya Trenggono Jurusan Teknik Metalurgi, Universitas Sultan Ageng Tirtayasa, Cilegon, Banten, Indonesia
Fuji Utari Jurusan Teknik Metalurgi, Universitas Sultan Ageng Tirtayasa, Cilegon, Banten, Indonesia

Keywords: ECA, nanocomposite, thermal properties, curing process temperature, sonication

Abstract

Electrically Conductive Adhesive (ECA) is an alternative solder substitute that does not contain Pb. In this research, we made nanocomposite from epoxy resin as matrix and Sn-3.5Ag nanoparticle as filler to determine the nanocomposite thermal properties for ECA applications. We used curing process temperature variations of 30, 65 and 95 ^oC with sonication for 30 minutes. Differential Scanning Calorimetry (DSC) analysis showed an increase of glass transition temperature (T_g) and degradation temperature (T_d), decreasing curing temperature (T_curing) as the curing process temperature increased while the melting temperature (T_m) and crystallization temperature (T_c) tend to be constant. T_g for curing process 30, 65 and 95 ^oC was 35.58; 37.41 and 43.77 ^oC respectively. T_d for curing process 30, 65 and 95 ^oC was 335.01; 337.50 and 342.49 ^oC. T_curing in the curing process 30 and 65 ^oC was 179.95 and 176.08 ^oC. Thermogravimetric Analysis (TGA) showed that nanocomposite T_d between 330-340 ^oC.